An Italian emerging EDA (Electronic Design Automation) company, delivering disruptive software solutions to enable and accelerate the 3D-design of electronic products is looking for 3 technological partners to apply for an H2020 EIC FTI. The project’s objective is to customize and demonstrate an advanced I/O planning technology that reduces design time, enabling a higher level of integration of 2.5D and 3D-IC for next generation electronic products in European and extra European markets.

To address the project needs, the Italian lead partner is looking for the following partners.

1) An Internet of Things and AI medium-sized Engineering firm, which will provide relevant electronic design use cases for the demonstration of the I/O planning and optimization technology. They will also provide input for eliciting the requirements of the design collaboration tools and will participate in the acceptance testing cycle.

2) A Design House or Semiconductor Company: specialized in ASIC development using standard EDA tools. It will collaborate with the Coordinator in the integration of the new customization capabilities

3) An RTD Software: R&D Organization, University, Technology-based company specialized on developing modern collaboration tools for product lifecycle management.

Més informació: https://een.ec.europa.eu/tools/services/PRO/Profile/Detail/ac4925f3-0699-4a52-bfae-e5cc11766a74