EEN: Cerca de socis recerca i desenvolupament Project relating to hierarchical I/O Planning, placement and optimisation for systems 4.0 11 d'abril 2019
An Italian emerging EDA (Electronic Design Automation) company, delivering disruptive software solutions to enable and accelerate the 3D-design of electronic products is looking for 3 technological partners to apply for H2020 EIC FTI. The Italian company provides software solutions to enable and accelerate the 3D design of latest generation electronic products and has just successfully applied to and won the EU Grant SME instrument phase 1 and 2. Partners Sought: An Internet of Things and AI medium-sized Engineering firm, which will provide relevant electronic design use cases for the demonstration of the I/O planning and optimization technology. They will also provide input for eliciting the requirements of the design collaboration tools and will participate in the acceptance testing cycle. A Design House or Semiconductor Company: specialized in ASIC development using standard EDA tools. It will collaborate with the Coordinator in the integration of the new customization capabilities An RTD Software: R&D Organisation, University, Technology-based company specialized on developing modern collaboration tools for product lifecycle management El coordinador vol presentar una proposta a la convocatòria FTI (Fast-Track to Innovation) amb termini 22/10/2019. Convocatòria: https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/eic-fti-2018-2020;freeTextSearchKeyword=;typeCodes=0,1;statusCodes=31094501,31094502,31094503;programCode=null;programDivisionCode=null;focusAreaCode=null;crossCuttingPriorityCode=null;callCode=H2020-EIC-FTI-2018-2020;sortQuery=openingDate;orderBy=asc;onlyTenders=false;topicListKey=topicSearchTablePageState Més informació per contactar amb l’empresa: https://www.swisseen.ch/en/searchdetail?id=108&ref=RDIT20190325001